[Remote] Senior Packaging Technical Engineer - Hardware
Note: The job is a remote job and is open to candidates in USA. NVIDIA is a leading technology company focused on harnessing the potential of AI to revolutionize computing. The role involves driving technology across multiple functions, with responsibilities including defining and implementing chip pad rings and collaborating with various engineering teams.
Responsibilities
- Your responsibilities include defining and implementing the chip pad ring, substrate interconnect scheme, and lead the package layout design process
- We collaborate with large teams consisting of Circuit, Signal Integrity, RTL, Place and Route, substrate layout and system design Engineers and Managers
- Work to define a chip floor plan, pad ring, substrate, and ball out implementing a robust world-class electrical package!
- Communicate effectively with various teams throughout the company
Skills
- BSEE or equivalent experience
- Minimum of 8+ years in board/system design
- Good understanding of transmission line theory, power delivery and signal integrity
- Hardworking and able to work with a minimum of supervision
- You seek to solve complex technical problems
- Experience with package design
- Programming and scripting skills in Perl, Python, Tcl
- Cadence Skill and EXCEL familiarity
Benefits
- Equity
- A comprehensive benefits package
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